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CY23S09, CY23S05
Low Cost 3.3V Spread Aware Zero Delay Buffer
Features

10 MHz to 100 and 133 MHz operating range, compatible with CPU and PCI bus frequencies Zero input-output propagation delay Multiple low skew outputs Output-output skew less than 250 ps Device-device skew less than 700 ps One input drives five outputs (CY23S05) One input drives nine outputs, grouped as 4 + 4 + 1 (CY23S09) Less than 200 ps cycle-to-cycle jitter is compatible with Pentium(R) based systems Test mode to bypass PLL (CY23S09 only, see Select Input Decoding for CY23S09 on page 2) Available in space saving 16-pin, 150-mil SOIC, 4.4 mm TSSOP, and 150-mil SSOP ( CY23S09) or 8-pin, 150-mil SOIC package (CY23S05) 3.3V operation, advanced 0.65 CMOS technology Spread Aware
MHz frequencies and have higher drive than the -1 devices. All parts have on-chip PLLs that lock to an input clock on the REF pin. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The CY23S09 has two banks of four outputs each, which can be controlled by the select inputs as shown in the Select Input Decoding table on Select Input Decoding for CY23S09 on page 2. If all output clocks are not required, Bank B can be three-stated. The select inputs also allow the input clock to be directly applied to the outputs for chip and system testing purposes. The CY23S09 and CY23S05 PLLs enter a power down mode when there are no rising edges on the REF input. In this state, the outputs are three-stated and the PLL is turned off, resulting in less than 12.0 A of current draw (for commercial temperature devices) and 25.0 A (for industrial temperature devices). The CY23S09 PLL shuts down in one additional case, as shown in the Select Input Decoding for CY23S09 on page 2. Multiple CY23S09 and CY23S05 devices can accept the same input clock and distribute it. In this case, the skew between the outputs of two devices is guaranteed to be less than 700 ps. All outputs have less than 200 ps of cycle-to-cycle jitter. The input to output propagation delay on both devices is guaranteed to be less than 350 ps; the output to output skew is guaranteed to be less than 250 ps. The CY23S05 and CY23S09 is available in two different configurations, as shown in the Ordering Information on page 6. The CY23S05-1 and CY23S09-1 is the base part. The CY23S05-1H and CY23S09-1H is the high drive version of the -1, and its rise and fall times are much faster than -1.

Functional Description
The CY23S09 is a low cost 3.3V zero delay buffer designed to distribute high speed clocks and is available in a 16-pin SOIC package. The CY23S05 is an 8-pin version of the CY23S09. It accepts one reference input, and drives out five low skew clocks. The -1H versions of each device operate at up to 100 and 133
Logic Block Diagram
Cypress Semiconductor Corporation Document Number: 38-07296 Rev. *D
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised October 22, 2008
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CY23S09, CY23S05
Select Input Decoding for CY23S09
S2 0 0 1 1 S1 0 1 0 1 CLOCK A1-A4 Three-state Driven Driven Driven CLOCK B1-B4 Three-state Three-state Driven Driven CLKOUT[1] Driven Driven Driven Driven Output Source PLL PLL Reference PLL PLL Shut-down N N Y N
Zero Delay and Skew Control
All outputs must be uniformly loaded to achieve Zero Delay between the input and output. Because the CLKOUT pin is the internal feedback to the PLL, its relative loading can adjust the input-output delay. This is shown in the above graph. For applications requiring zero input-output delay, all outputs, including CLKOUT, must be equally loaded. Even if CLKOUT is not used, it must have a capacitive load equal to that on other outputs, to obtain zero input-output delay. If input to output delay adjustments are required, use the above graph to calculate loading differences between the CLKOUT pin and other outputs. For zero output-output skew, be sure to load all outputs equally. For further information, refer to the application note "CY23S05 and CY23S09 as PCI and SDRAM Buffers."
Spread Aware
Many systems being designed now use a technology called Spread Spectrum Frequency Timing Generation. Cypress is one of the pioneers of SSFTG development and designed this product so as not to filter off the Spread Spectrum feature of the Reference input, assuming it exists. When a zero delay buffer is not designed to pass the SS feature through, the result is a significant amount of tracking skew, which may cause problems in systems requiring synchronization. For more details on Spread Spectrum timing technology, please see the Cypress application note AN1278, EMI Suppression Techniques with Spread Spectrum Frequency Timing Generator (SSFTG) ICs.
Pin Configurations
Figure 1. Pin Diagram - CY23S09 Figure 2. Pin Diagram - CY23S05
Note 1. This output is driven and has an internal feedback for the PLL. The load on this output can be adjusted to change the skew between the reference and output.
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Pin Description for CY23S09
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 REF[2] CLKA1[3] CLKA2[3] VDD GND CLKB1[3] CLKB2[3] S2[4] S1[4] CLKB3[3] CLKB4[3] GND VDD CLKA3[3] CLKA4[3] CLKOUT[3] Signal Buffered clock output, bank A Buffered clock output, bank A 3.3V supply Ground Buffered clock output, bank B Buffered clock output, bank B Select input, bit 2 Select input, bit 1 Buffered clock output, bank B Buffered clock output, bank B Ground 3.3V supply Buffered clock output, bank A Buffered clock output, bank A Buffered output, internal feedback on this pin Description Input reference frequency, 5V tolerant input
Pin Description for CY23S05
Pin 1 2 3 4 5 6 7 8 REF[2] CLK2[3] CLK1[3] GND CLK3[3] VDD CLK4[3] CLKOUT[3] Signal Buffered clock output Buffered clock output Ground Buffered clock output 3.3V supply Buffered clock output Buffered clock output, internal feedback on this pin Description Input reference frequency, 5V tolerant input
Notes 2. Weak pull-down. 3. Weak pull-down on all outputs. 4. Weak pull-up on these inputs.
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Maximum Ratings
Supply Voltage to Ground Potential................-0.5V to +7.0V DC Input Voltage (Except REF) ............ -0.5V to VDD + 0.5V DC Input Voltage REF ............................................. -0.5V to 7V
Storage Temperature ................................. -65C to +150C Maximum Soldering Temperature (10 seconds)......... 260C Junction Temperature ................................................. 150C Static Discharge Voltage (per MIL-STD-883, Method 3015) ........................... > 2,000V
Operating Conditions for CY23S05SC-XX and CY23S09SC-XX Commercial Temperature Devices[5]
Parameter VDD TA CL CL CIN Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance Description Min 3.0 0 Max 3.6 70 30 10 7 Unit V C pF pF pF
Electrical Characteristics for CY23S05SC-XX and CY23S09SC-XX Commercial Temperature Devices
Parameter VIL VIH IIL IIH VOL VOH IDD (PD mode) IDD Description Input LOW Voltage[6] Input HIGH Voltage[6] VIN = 0V VIN = VDD IOL = 8 mA (-1) IOH = 12 mA (-1H) IOH = -8 mA (-1) IOL = -12 mA (-1H) REF = 0 MHz Unloaded outputs at 66.67 MHz, SEL inputs at VDD 2.4 12.0 32.0 2.0 50.0 100.0 0.4 Input LOW Current Input HIGH Current Output LOW Voltage[7] Output HIGH Voltage[7] Test Conditions Min Max 0.8 Unit V V A A V V A mA
Power Down Supply Current Supply Current
Switching Characteristics for CY23S05SC-1 and CY23S09SC-1 Commercial Temperature Devices [8]
Parameter t1 Description Output Frequency Duty Cycle[7] = t2 / t1 t3 t4 t5 t6 t7 tJ tLOCK Rise Time[7] Skew[7] Fall Time[7] Output-to-Output 30 pF load 10 pF load Measured at 1.4V, Fout = 66.67 MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded 0 0 Test Conditions Min 10 10 40.0 50.0 Typ Max 100 133.33 60.0 2.50 2.50 250 350 700 200 1.0 Unit MHz MHz % ns ns ps ps ps ps ms
Delay, REF Rising Edge to Measured at VDD/2 CLKOUT Rising Edge[7] Device-to-Device Skew[7] Cycle-to-Cycle Jitter[7] PLL Lock Time
[7]
Measured at VDD/2 on the CLKOUT pins of devices Measured at 66.67 MHz, loaded outputs Stable power supply, valid clock presented on REF pin
Notes 5. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power up. Power supply sequencing is NOT required. 6. REF input has a threshold voltage of VDD/2. 7. Parameter is guaranteed by design and characterization. Not 100% tested in production. 8. All parameters specified with loaded outputs.
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Switching Characteristics for CY23S05SI-1H and CY23S09SI-1H Industrial Temperature Devices[8]
Parameter t1 Description Output Frequency Duty Cycle[7] = t2 / t1 Duty Cycle t3 t4 t5 t6 t7 t8 tJ tLOCK
[7]
Test Conditions 30 pF load 10 pF load Measured at 1.4V, Fout = 66.67 MHz Measured at 1.4V, Fout <50.0 MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded
Min 10 10 40.0 45.0
Typ
Max 100 133.33
Unit MHz MHz % % ns ns ps ps ps V/ns
50.0 50.0
60.0 55.0 1.50 1.50 250
= t2 / t1
Rise Time[7] Fall Time[7] Output-to-Output Skew[7]
Delay, REF Rising Edge to Measured at VDD/2 CLKOUT Rising Edge[7] Device-to-Device Skew[7] Output Slew Rate[7] Cycle-to-Cycle Jitter[7] PLL Lock Time[7] Measured at VDD/2 on the CLKOUT pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 Measured at 66.67 MHz, loaded outputs Stable power supply, valid clock presented on REF pin 1
0 0
350 700
200 1.0
ps ms
Switching Waveforms
Duty Cycle Timing
t1 t2 1.4V 1.4V 1.4V
All Outputs Rise/Fall Time
OUTPUT 2.0V 0.8V t3 2.0V 0.8V t4 3.3V 0V
Output-Output Skew
OUTPUT 1.4V
OUTPUT t5
1.4V
Input-Output Propagation Delay
INPUT VDD/2
OUTPUT t6
VDD/2
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Switching Waveforms continued
Device-Device Skew
CLKOUT, Device 1
VDD/2
CLKOUT, Device 2 t7
VDD/2
2309-8
Test Circuits
Test Circuit # 1
V DD 0.1 F CLK out OUTPUTS C LOAD V DD 0.1 F GND GND 0.1 F 0.1 F
Test Circuit # 2
V DD OUTPUTS 10 pF V DD GND GND 1 kW 1 kW
For parameter t8 (output slew rate) on -1H devices
Ordering Information
Ordering Code CY23S05SC-1 CY23S05SC-1H CY23S09SC-1 CY23S09SC-1H CY23S09ZC-1 CY23S09ZC-1H CY23S09OC-1 CY23S09OC-1H Pb-Free CY23S05SXC-1 CY23S05SXC-1H CY23S09SXC-1 CY23S09SXC-1H CY23S09ZXC-1 CY23S09ZXC-1H CY23S09OXC-1 CY23S09OXC-1H S8 S8 S16 S16 Z16 Z16 O16 O16 8-pin 150-mil SOIC 8-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 4.4 mm TSSOP 16-pin 4.4 mm TSSOP 16-pin 150-mil SSOP 16-pin 150-mil SSOP Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Active Active Active Active Obsolete Active Obsolete Obsolete Package Name S8 S8 S16 S16 Z16 Z16 O16 O16 Package Type 8-pin 150-mil SOIC 8-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 4.4 mm TSSOP 16-pin 4.4 mm TSSOP 16-pin 150-mil SSOP 16-pin 150-mil SSOP Operating Range Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Active Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Status
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Package Diagrams
Figure 3. 8-Pin (150-Mil) SOIC S8
8 Lead (150 Mil) SOIC - S08
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN. MAX. 2. PIN 1 ID IS OPTIONAL, ROUND ON SINGLE LEADFRAME RECTANGULAR ON MATRIX LEADFRAME 3. REFERENCE JEDEC MS-012
0.230[5.842] 0.244[6.197]
0.150[3.810] 0.157[3.987]
4. PACKAGE WEIGHT 0.07gms
PART # S08.15 STANDARD PKG. 5 8 SZ08.15 LEAD FREE PKG.
0.189[4.800] 0.196[4.978]
SEATING PLANE
0.010[0.254] 0.016[0.406]
X 45
0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.004[0.102] 0.0098[0.249] 0~8 0.016[0.406] 0.035[0.889] 0.0075[0.190] 0.0098[0.249]
0.0138[0.350] 0.0192[0.487]
51-85066-*C
16 Lead (150 Mil) SOIC
8
Figure 4. 16-Pin (150-Mil) SOIC S16.15
PIN 1 ID
1 DIMENSIONS IN INCHES[MM] MIN. MAX. REFERENCE JEDEC MS-012
0.150[3.810] 0.157[3.987] 0.230[5.842] 0.244[6.197]
PACKAGE WEIGHT 0.15gms
PART # S16.15 STANDARD PKG. SZ16.15 LEAD FREE PKG. 9 16
0.386[9.804] 0.393[9.982]
SEATING PLANE
0.010[0.254] 0.016[0.406]
X 45
0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.0138[0.350] 0.0192[0.487] 0.004[0.102] 0.0098[0.249]
0~8
0.016[0.406] 0.035[0.889]
0.0075[0.190] 0.0098[0.249]
51-85068-*B
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Package Diagrams continued
Figure 5. 16-Pin TSSOP 4.40 mm Body Z16.173
PIN 1 ID
1
DIMENSIONS IN MM[INCHES] MIN. MAX. REFERENCE JEDEC MO-153
6.25[0.246] 6.50[0.256] 4.30[0.169] 4.50[0.177]
PACKAGE WEIGHT 0.05 gms PART # Z16.173 STANDARD PKG. ZZ16.173 LEAD FREE PKG.
16
0.65[0.025] BSC.
0.19[0.007] 0.30[0.012]
1.10[0.043] MAX.
0.25[0.010] BSC GAUGE PLANE 0-8
0.076[0.003] 0.85[0.033] 0.95[0.037] 0.05[0.002] 0.15[0.006] SEATING PLANE 0.50[0.020] 0.70[0.027] 0.09[[0.003] 0.20[0.008]
4.90[0.193] 5.10[0.200]
51-85091-*A
Figure 6. 16-Pin (150-Mil) QSOP Q1
51-85053-*B
Document Number: 38-07296 Rev. *D
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CY23S09, CY23S05
Document History Page
Document Title: CY23S09/CY23S05 Low Cost 3.3V Spread Aware Zero Delay Buffer Document Number: 38-07296 Rev. ** *A *B *C *D ECN No. 111147 111773 122885 267849 2595524 Submission Date 11/14/01 02/20/02 12/22/02 See ECN 10/23/08 Orig. of Change DSG CTK RBI RGL Description of Change Changed from spec number 38-01094 to 38-07296 Added 150-mil SSOP option Added power-up requirements to Operating Conditions Added Lead-Free devices
CXQ/PYRS Added device "Status" to Ordering Information
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(c) Cypress Semiconductor Corporation, 2001-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-07296 Rev. *D
Revised October 22, 2008
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Pentium is a registered trademark of Intel Corporation. Spread Aware is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document may be the trademarks of their respective holders.
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